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BGA Rework stations

WISDOMSHOW WDS-520 BGA/microBGA Station 3,5KW

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WISDOMSHOW WDS-520 BGA/microBGA Station 3,5KW

WISDOMSHOW WDS-520 BGA/microBGA Station 3,5KW new BGA is mobile repair expert machine design telephones rework station with laser position.

Aoyue BGA Station 9001

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Aoyue BGA Station 9001

Aoyue BGA Station 9001 is designed to work with different size BGA, QFP and others. It has an advanced optical system "SPLIT VISION" and a precise positioning system solder system with which you can easily and safely replace every system. The built-in LCD monitor allows for precise adjustment of the position of the solder on the board. The five available profiles of heating and additionally the possibility of changing the parameters allow you to adjust parameters of the station to any needs. In addition the station has Soldering irons 70W. It is designed for lead-free soldering. Indispensable when replacing the motherboard chipsets, CPUs, GPUs and other demanding precision positioning.

Aoyue Int732 Soldering Station

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Aoyue Int732 Soldering Station

Aoyue Int732 Soldering Stationis designed for reball big PCB, eg .: laptops, gaming consoles (XBOX360 etc) and other large surfaces. Aoyue Int732 has a universal, multi-PCB holder, large-area heater, the top emitter of heat 500W and Soldering irons. With three additional sensors and temperature profiles using heating process, the station allows easy and safe przelutowaæ any BGA. Unlike other repair stations Aoyue BGA company, in this model for upper heat source corresponds to the IR emitter which allowed the extension of the station uptime and eliminating the need for periodic replacement of expensive infrared lamps.

Infrared Soldering Station Aoyue 710

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Infrared Soldering Station Aoyue 710

Infrared Soldering Station Aoyue 710 is an advanced station with manual IR. Applied technology eliminates the problem of shifting adjacent to the soldered components. The source of heat is here IR lamp, and a quartz heater. Ideally suited to work with BGA, micro BGA, QFP, PLCC, SOIC and small SMD components. The use of the heater allows you to prevent deformation of the plate soldering.

Infrared Soldering Station Aoyue int720

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Infrared Soldering Station Aoyue int720

Infrared Soldering Station Aoyue int720 is an advanced rework station, infrared heater and soldering irons. It has an IR lamp mounted in an adjustable holder for easy operation. All operating parameters are set and read digitally. Applied technology eliminates the problem of shifting adjacent to the soldered components. The source of heat is here IR lamp, and a quartz heater. Closed loop temperature control ensures the safety of soldered components. Ideally suited to work with BGA, micro BGA, QFP, PLCC, SOIC and small SMD components. The use of the heater allows you to prevent deformation of the plate soldering. It has an IR radiation shield that protects the user's eyesight. Designed primarily for use with larger systems such as .: chipsets, motherboards, chipsets, embedded processors in systems and others.

Soldering station BGA TouchBGA GM490 5,45kW LCD 7

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Soldering station BGA TouchBGA GM490 5,45kW LCD 7"

Soldering station BGA TouchBGA GM490 5,45kW LCD 7" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TOUCHBGA GM5860L 5,45kW LCD 7 with laser pointer

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Soldering station BGA TOUCHBGA GM5860L 5,45kW LCD 7 with laser pointer

Soldering station BGA TOUCHBGA GM5860L 5,45kW LCD 7 with laser pointer" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TouchBGA IR6000+HR6000 2in1 3250W

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Soldering station BGA TouchBGA IR6000+HR6000 2in1 3250W

Soldering station BGA TouchBGA IR6000+HR6000 2in1 3250W is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA WISDOMSHOW WDS-550 5,1kW LCD 7

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Soldering station BGA WISDOMSHOW WDS-550 5,1kW LCD 7"

Soldering station BGA WISDOMSHOW WDS-550 5,1kW LCD 7" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

Soldering station BGA WISDOMSHOW WDS-420 4kW LCD 4,3

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Soldering station BGA WISDOMSHOW WDS-420 4kW LCD 4,3"

Soldering station BGA WISDOMSHOW WDS-420 4kW LCD 4,3" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

Soldering station BGA TOUCHBGA GM590 6900W LCD 7

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Soldering station BGA TOUCHBGA GM590 6900W LCD 7"

Soldering station BGA TOUCHBGA GM590 6900W LCD 7" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Rework Station TouchBGA GM390 5,45kW LCD 4,3

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Rework Station TouchBGA GM390 5,45kW LCD 4,3"

Rework Station TouchBGA GM390 5,45kW LCD 4,3" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TOUCHBGA GM330 IR + HR 3,85kW

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Soldering station BGA TOUCHBGA GM330 IR + HR 3,85kW

Soldering station BGA TOUCHBGA GM330 IR + HR 3,85kW is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TOUCHBGA GM5860 5,45kW CCD LCD 7

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Soldering station BGA TOUCHBGA GM5860 5,45kW CCD LCD 7"

Soldering station BGA TOUCHBGA GM5860 5,45kW CCD LCD 7" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TOUCHBGA GM5860 5,45kW LCD 7

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Soldering station BGA TOUCHBGA GM5860 5,45kW LCD 7"

Soldering station BGA TOUCHBGA GM5860 5,45kW LCD 7" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TOUCHBGA GM5860A 5,45kW CCD LCD 7 auto lowered upper heater

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Soldering station BGA TOUCHBGA GM5860A 5,45kW CCD LCD 7 auto lowered upper heater

Soldering station BGA TOUCHBGA GM5860A 5,45kW CCD LCD 7 auto lowered upper heater" is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TOUCHBGA GM5860A 5,45kW LCD 7 auto lowered upper heater

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Soldering station BGA TOUCHBGA GM5860A 5,45kW LCD 7 auto lowered upper heater

Soldering station BGA TOUCHBGA GM5860A 5,45kW LCD 7 auto lowered upper heater is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TouchBGA IR-PRO-SC v6 3in1 4150W

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Soldering station BGA TouchBGA IR-PRO-SC v6 3in1 4150W

Soldering station BGA TouchBGA IR-PRO-SC v6 3in1 4150W is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Soldering station BGA TouchBGA IR6000 1250W

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Soldering station BGA TouchBGA IR6000 1250W

Soldering station BGA TouchBGA IR6000 1250W is a professional station for removing and assembly of BGA, SMD, uBGA, CBGA, CCGA, CSP, QFN, MLF, PGA soldered with leaded and lead-free technology. Station is used for servicing motherboards of computers, laptops, consoles, mobile phones, car navigation and modules, and many other devices, so it has a strong position in all electronic services, or GSM.

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Stacja lutownicza BGA TouchBGA GM490 4,3kW CCD LCD 17
Sours: https://multi-com.eu/multicom/

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IR1000 Infrared BGA & SMT Rework Station

IR1000 Infrared BGA & SMT Rework Station

Infrared BGA & SMT Rework at a Price that Can't Be Beat! The IR 1000 is a low-cost, remarkably flexible and effective rework system, capable of installing and removing passives, QFP's, SOIC's, PLCC's, MLF's, LCCC's, TSOP's, QFN's and BGA's. It is ideal for post assembly rework, repair, and low volume/short run production operations. Economical and easy to use, the IR 1000 delivers high-end functionality, moving far beyond expensive, bulky rework stations by offering unparalleled performance at an affordable price. It does not require heat-focusing nozzles, saving you thousands in additional costs. A microprocessor driven, semi-automated system that does not require an external PC, the IR 1000 allows for simple one zone profiles up to more complicated multi zone profiles and features PACE’s exclusive “Learn Mode” that assists the user with developing profiles. The unit uses a combination of IR top heating coupled with powerful IR bottom heating for an effective, repeatable heating process. An optional PC software package offers an easy operator interface and greater flexibility, allowing for profile management and graphing of temperature data.

  • Features

    The system has an automated cooling fan that is activated simply by moving it into place.

    The spring loaded vacuum pik can be used to automatically lift the component off the PCB upon complete reflow. 

    Laser centering indicator assists in positioning the PCB directly under the heaters and vacuum pik.

    Temperature probe is fitted with a ball/yoke positioner that is held in place with a magnet for maximum flexibility and to get to those hard to reach spots on the PCB.

    System is fitted with a built in vacuum wand that allows for manual removal if required. 

    Pre-Heater monitoring prevents an operator from beginning a profile when the heater is not ready.

    Pre-Heater can be turned off or put into SetBack when system is not being used.

    Vacuum pik has built in theta adjustment for easy positioning of components.

    Made in the USA

  • Specifications

    Power Requirements

    115 VAC, 50/60Hz (Domestic) or 230VAC, 50/60Hz (Export) 1000W

    Preheater (bottom-side)

    400 Watts, 65 to 176°C (150 to 350°F)

    Main (Top) Heater

    IR, 250 watts x 2 (500 W total)

    Max PC Board Size

    305 x 305mm (12" x 12")

  • More Information

    Advanced Features

    IR 1000 Heaters

    Powerful IR Reflow Head Does Not Require Nozzles

    A medium/long wavelength infrared heater responds faster, with more power, than any ceramic or carbon IR emitter currently available.
    IR 1000 Red Beam

    IR Bottom-Side Preheater

    The bottom preheater features an incredibly efficient, high power (400W), quick response quartz IR emitter.
    IR 1000 Cooling Fan

    Automated Active Cooling Fan

    The system has an automated Active Cooling Fan that is activated simply by moving it into place, or manually actuated if desired.
    IR 1000 Front Panel

    Operator-Friendly Front Panel Design

    Incorporates a non-complex, intuitive front panel design, which allows selection of programming functions, and control of process parameters.
    IR 1000 applmshot

    Spring-Loaded Vacuum Pick Automatically Lifts Components

    Spring-loaded Vacuum Pick can be used to automatically lift component off the PCB upon complete reflow and features theta adjustment.
    IR 1000 Pik

    Pik-Vac Component Handling Wand

    The IR 1000 is fitted with a built-in vacuum handling wand that allows for manual removal or placement of SMD's, if required.
    IR 1000 Laser

    Laser Centering Indicator

    A Laser Centering Indicator assists in positioning the component directly under the Heater Head and Vacuum Pick.
    IR 1000 Temp Probe

    Magnetically Mounted Temperature Probe

    A Temperature Probe is attached to a magnetic ball/yoke positioner to measure temperature on hard to reach spots on the PCB.
  • Compatible Products

  • Resources

  • Manuals

    IR 1000 Infrared Rework Station Manual

  • Brochures

    IR1000 Infrared BGA/SMT Rework Station Brochure

  • Additional Videos

Sours: https://paceworldwide.com/ir1000-infrared-bga-smt-rework-station
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BGAs or Ball Grid Arrays can be one of the most difficult Surface Mount Device (SMD) package types when it comes to solder rework. Having a good BGA rework station is critical to troubleshoot and replace these types of components. Many of today’s most advanced SDR or software defined radio chipsets are BGA package types. There are a few reasons why BGA rework is so difficult. The solder pads are located underneath the package body. The large surface area makes it difficult to evenly reflow the solder pads without overheating surrounding components. With any electronic rework operation it is important to test continuity and function before and after any major rework event.


TL;DR: Here’s our top pick for the best BGA/SMD Rework Station

Our top pick came in as the T862++ IR BGA Rework Station with pre-warmer. It offered a good balance between features and affordability.


DISCLAIMER: This post contains affiliate links. Making a purchase using these links won’t cost you any more. They will allow us to collect a small fee that we use to keep the our site updated with great content.

Methodology for ranking BGA/SMD Rework Stations

Deciding on a BGA/SMD rework station can be a daunting task. Luckily, we’ve done the homework and research for you. We reviewed several facets including heating source, power consumption, utilities required, usability, and of course cost.

The BGA rework stations we considered are geared more for small labs and hobbyists, and low volume prototyping operations. If you’re looking for something more serious for a true production environment, we recommend checking out the folks over at PCB-Repair.com. You can read more about each of these review criteria at the end of this post.

Without further ado, here is our short list of great BGA rework stations.

Top 5 BGA/SMD Rework Stations

1. T862++ SMD/BGA Benchtop Rework Station

T862++ BGA Rework Station

The T862++ BGA Rework Station is a true IR based rework station. It includes an IR light source and 3 lenses that can be used to focus the heat energy on the BGA or component to be reworked or removed. The T862++ also includes IR heated ceramic “pre-warmer” hot plate that is useful to bring the entire board up to an elevated temperature slightly lower than the reflow temperature. The T862++ also includes a touch-up soldering iron and stand for quick hand solder touch-ups.

In terms of controlling the various heat sources, the T862++ offers digital control of each of the three heating elements, the IR pre-warmer, the IR lamp, and the touch-up soldering iron. Each controller includes an on/off switch as well as (+) and (-) buttons to dial in the temperature that you desire.

The work area of the T862++ is 120mm by 120mm and features adjustable rails for holding PCB assemblies. With adjustment rails only in 1 axis, it may be difficult to capture and hold odd shaped circuit cards. In terms of utilities and power consumption, the T862++ BGA rework station can run off of normal 110V AC and has a total output power of 800W, 650W of that power budget going to the “pre-warmer” hot plate.

Overall, the T862++ has a good set of features for a very affordable price which is why it ranked number 1 on our list of great BGA Rework Stations.

2. IR6500 IR BGA/SMD Rework Station

IR6500 BGA Rework Station

The IR6500 BGA Rework Station is larger and higher power benchtop rework station. The IR6500 uses IR heating for both the top and the bottom heating elements. The heating elements are closed loop controlled and can be pre-programmed with various temps and ramp rates. The IR6500 benchtop rework station also includes that ability to connect the unit to a PC through an included USB cable and control the heaters using included software.

The IR6500 offers one of the largest work areas of the units we researched at 400mm x 350mm. The work area also features highly adjustable rails to secure and hold unique circuit shapes and sizes. The IR6500 uses 110V power and has a total power usage of 1250W. Although this is a significant amount of power, it seems the IR6500 suffers from slow heating, particularly with the bottom heater. Its important to monitor the actual temperature of our circuit card, and not just the temperature of the heaters.

Due to the added features of the heater controllers, the IR6500 is less user friendly than T862++ above. It can handle larger CCAs, but at more than twice the price of the T862++, we’d really only recommend the IR6500 for more experienced users that need finer control over heating and a larger work area.

3. T-890 SMD/BGA Rework Station

The T-890 is a benchtop IR based BGA rework station. This unit features the ability to run off of either 110V or 220V power. The total output power of the T-890 is a whopping 1500W. Most of that poower is used for the bottom pre-heater element, with 300W coming from the IR lamp up top.

The T-890 is a larger rework station, so it can handle fairly large circuit assemblies. The work area is 330mm by 320mm. The overall design is compact and simple, without a nest of wires that can be seen with some of the other units. The T-890 BGA rework station also offers an all digital temperature controller and includes 8 preset temperature profiles pre-loaded. This can be helpful for dialing in the appropriate temperatures for a wide variety of circuit cards.

Pricing for the T-890 can vary widely, so it’s important to shop around and find the best price. We consider the T-890 to be a good no-frills option if you already have some other basic equipment in your lab, like soldering irons and stands.

4. Aoyue 866 Hot Air Rework Station

The Aoyue 866 Hot Air Rework Station is our favorite hot air unit on our list. It offers an affordable price, compact design and a ton of accessories. The Aoyue 866 comes with an “IR” base heater for pre-warming, and both a high power heat gun and a soldering iron. The base comes with a special holder that is designed to hold the heat gun and be positioned where desired. It does not offer a ton of adjustment options, but for the price the Aoyue 866 is good budget option.

The baseplate IR pre-heater is quartz IR based heater. In terms of temperature control, the Aoyue 866 offers digital control of the pre-heater, air gun, and soldering iron. There is also an analog control know to adjust the air flow. It is important to adjust airflow which can blow tiny parts off boards if too strong.

As mentioned, the Aoyue 866 is a compact unit with a work area of 140mm by 140mm. The unit is powered by standard 110V and has total outpout power of around 400W. One of the best features of this rework station is the number of accessories that come with the Aoyue 866. It includes a vacuum pen for picking up small surface mount parts. It also includes a small spatula for the same purpose. Additionally, the Aoyue 866 comes with multiple tips for the air gun and tips for the soldering iron. It even comes with a toolbox to store all your accessories!

5. YIHUA 862BD+ Hot Air and Soldering Station, plus BGA Preheater Station

professional rework station soldering station phone laptop mobile repair refurbish electronic repair

Our final BGA rework station is a bit of a DIY option for the most budget conscience. It is possible to build your own BGA hot air rework station. This is done by combining a hot air gun and soldering station with a hot plate. For this option we’ve highlighted the Yihua 862BD+ Solder/ Hot Air Rework Station. To finish this out, we’re recommending a basic benchtop hot plate.

INTBUYING 110V BGA Preheater Station Soldering Preheating Hot Plate Rework Heater

The Yihua 862BD+ offers digital control for both the soldering iron and the hot air gun. There is also an analog control knob for controlling air flow. This rework station runs on 110V and has a total power rating of 750W. If you add a decent digital controlled hot plate, you can create a BGA rework station for an affordable price.

Heat Sources

Two of the most common BGA/SMD rework station heat sources are hot air and infrared. Hot air BGA/SMD rework stations use different nozzles or heat guns to direct heated air at the part to be reworked. The higher end rework stations will include multiple nozzles that can be positioned precisely to guide the heat. Lower end models have a simple heat gun.

Infrared or IR rework stations use infrared rays as a heat source. IR BGA rework stations are less complex, but several vendors on the low end try to pass simple IR heat plates as true IR rework stations. In reality, true IR rework stations use IR lamps to precisely direct IR light at components. These light sources often include shutters and lenses used to shield surrounding components from the IR light. One consideration for IR SMD rework stations is that they often struggle heating light colored or silver bodied components due to high reflectivity of the case. This can often be overcome by using black tape on top of the components being reworked.

Power Consumption and Utilities Needed

BGA rework stations get hot! Like, really hot! Hot air rework stations typically pump out super heated air somewhere between 300 and 400 degrees Fahrenheit! It takes a lot of power to generate that much heat. An important consideration when picking a BGA rework station is the power consumption and utilities needed. Simpler rework stations can run off of normal 110V power and can be set up in a well ventilated area. Higher end BGA rework stations will run off of 220V and could require addition utilities. There would be nothing worse than unboxing and setting up your BGA rework station only to find out you don’t have the right utilities or power available.

Affordability

The pricing for BGA rework stations can vary from a couple hundred dollars for the most basic options, to several thousands of dollars. Combine that with the complexity caused by multiple vendors offering basically the same machine, and things can get confusing quickly. For our review we scoured to find the best price for each model and took affordability into account when ranking these BGA rework stations.


Sours: https://fromdc2daylight.com/5-great-bga-rework-stations-for-your-lab/
The PROPER way to solder BGA chips.

A Ball Grid Array (BGA) is a packaging for surface mounting of integrated circuits. BGA packages have more interconnection pins than a flat or dual inline package so they can permanently mount devices such as microprocessors. BGA rework is the repair or refinishing operation of a BGA. We desolder and then re-solder the surface-mounted electronic components. Batch processing cannot repair a single device. Hence, we need expert personnel who use appropriate equipment for replacing defective components. We use a hot air station or a hot air gun for melting solder and heating devices, and then we use specialized tools for picking up and positioning tiny components. So, BGA rework is more cost-effective than the manufacturing of new BGAs. Hence, this method is favorable in the industry.

BGA Rework Process

We need a dedicated setup if we use BGA rework for industrial applications. BGA rework requires Highly skilled and well-trained personnel who know how to work with sophisticated tools. The steps involved in a BGA rework are,

1. Component Removal

A BGA rework needs preheating before the removal of any component. We apply localized heat from the top of the component and the solder melts. Then we remove the component from the BGA via a vacuum.

2. Site Dressing and Solder Removal

This step requires fixtures for holding the component down while the exposed solder is faced up. Then the component is kept flat by the vacuum from beneath, and vacuum on the top allows for removing the residual solder.

3. Component Attachment and Re-soldering

Once we have removed the components and cleaned the sites, then the next and final step is re-soldering. In this step, we reattach repaired or replacement components to the BGA by using soldering. A complementary technique is solder dipping, where we dip the BGA into a pre-determined soldering fixture.

Common Mistakes of BGA Rework

BGA rework is mainly dependent on science, but art plays a major role as well. The operator must have deep knowledge of the rework phenomenon and skilled hands for handling delicate components. This makes BGA Rework one of the most difficult and challenging industrial procedures.

Here are six common BGA Rework mistakes which you must avoid,

1. Inappropriate Operator Training

We can’t emphasize this enough. BGA rework technicians should have a lot of experience, have appropriate training, and developed skills. A BGA rework technician must understand the tools, the used material, the process steps, and the parameters involved. The technician must be able to evaluate the progress of a BGA rework and scale it accordingly. He must be able to recognize the indications of the process being off-track.

2. Inadequate Equipment Selection

You must use the right tools for doing a perfect job, and the same goes for the BGA rework. The equipment must have the desired flexibility and sophistication. It should allow for sustaining a predictable, repeatable, and controlled process.

This includes the robustness for delivering heat as required by the process, closed-loop thermal control and sensing, and handling abilities for replacement and removal. So, you must use the best equipment available because it is directly related to the quality of a BGA rework.

3. Poor Profile Development

The BGA rework profile is very important, and you won’t be able to attain a repeatable and successful BGA rework process without it.

A poorly-developed thermal profile can lead to damaging the BGA assembly or components. This can lead to requiring additional rework cycles, which can be very costly. Hence, the operator must develop excellent profiles with the utmost care by using the correct placement of thermocouples and analyzing the data provided by them.

4. Improper Preparation

We need a lot of preparation before the application of the first heat cycle to the rework site. This includes removing moisture from the BGA assembly for preventing subsequent problems and removal/protection of adjacent heat-sensitive components for avoiding inadvertent reflow or damage.

We need to make many decisions in advance, which significantly affects the BGA rework. These include whether or not to use solder paste, selecting the correct solder paste stencil, and selecting the right chemical compositions and alloys.

We need to appropriately set everything in place before the initiation of actual rework cycled. These include an accurate evaluation of the solder ball size, ball and device co-planarity, taking care of solder mask damage and contaminated pads at various sites.

5. Collateral Heat Damage

Reflow of adjacent component solder connections may result in de-wetting, lead and pad damage, oxidation, starved joints, wicking, component damage, and other problems. This may lead to numerous rework issues.

The BGA rework operator must be the effect of heat on the BGA device and adjacent components at all times. The objective here is to minimize the migration of heat beyond the BGA component under rework. This depends on tight process control and a well-developed profile.

6. Insufficient Post-Placement Inspection

It is difficult to observe what lies beneath a BGA component with the naked eye. But today, sophisticated x-ray machines are available, which allow us to see below the BGA component. This helps in avoiding problems like poor placement, excessive voiding, and poor alignment.

An x-ray system operator needs proper training for correct understanding and interpretation of the generated image. The complexity of the BGA component and the x-ray image variants demand that we obtain maximum benefits from this sophisticated equipment.

BGA Rework Stations

There are two main types of BGA rework stations,

1. Hot Air Stations

2. Infrared (IR) Stations

The main difference between them is the way they heat a BGA.

Hot-air rework stations use hot air for heating the BGAs. Nozzles of varying diameter direct hot air on the area of the circuit board, which needs repairment.

Infrared (IR) rework stations use infrared precision beams or heat lights for heating the BGAs. Ceramic heaters are used by the low to mid-tier IR rework stations, and they use louvers for isolating the areas of focus on a BGA. The upper-tier IR rework stations use focus beams, which provide better isolation to the BGA without causing heat damage to the adjacent regions. We can focus the beam with varying intensity and scope on various areas of the BGA.

How to choose the right BGA rework station?

Both kinds of rework stations have their pros and cons. To decide whether to go with hot air or IR for your company, you must consider both their features and take into account how they will perform in your work environment.

You need to factor in the following parameters when deciding on your BGA rework stations,

1. Temperature Control

Hot-air rework stations usually focus heated air on the top and use an unfocused board heater for the lower portion. The airflow will heat over the BGA and under it, as well. In certain rework stations, the plate used for heating of the lower portion has holes that allow for the passage of heated air.

The IR rework stations don’t include a bottom-side focus for heated air. IR rework stations typically use a heat light equipped with a black diffuser that makes it easier to heat the BGA evenly.

2. Efficiency

The hot air rework stations have nozzles that allow for focusing of airflow on different areas of BGA. If the operator is skilled at his job, then he can complete the task quickly. Because the hot air workstations make it easier to isolate the delicate details which are hard to heat.

IR workstations don’t need nozzles as each beam can refocus as per the operator’s command. But it may take longer to bring more delicate details to the required temperature. As IR workstations are very sophisticated; therefore, the staff needs to be better trained, and employees will need more time to develop the required skills.

3. PCB Specs

The sensitivity and size of your BGAs will also affect the kind of rework station, which will be more suited to your operations. Some rework stations can hold BGAs up to 36 inches.

The space within the heater should have enough room to accommodate the BGA such that the temperature of the entire BGA can be raised up to 150° C. This will help in offsetting any prospective warping effects.

The age of the BGAs being used will also affect the kind of rework stations you should choose. In the last two decades, load-free soldering has become the standard practice. As a result, we need to rework the BGAs at higher temperatures. Older BGAs need less heat for reworking because they used tin-lead solder, which melts at lower temperatures. If the rework involves new BGAs, then you will need a powerful rework station that may achieve high temperatures.

Effective BGA rework requires a high-end setup, a sophisticated work environment, and a well-trained operating staff. Many manufacturing companies don’t have the capital or resources for arranging these and end up producing poor quality BGAs. The smart way to address this is to reach out to a company like MOKO Technology, which only manufactures PCB and PCBA but also specializing in BGA rework. Our operators are highly skilled and well-trained, which allows for a greater degree of customization. Hence, we will tailor our BGAs to meet your specific requirements. Feel free to contact us if you have any further queries or if you would like to ask for a potential quote.

Sours: https://www.mokotechnology.com/bga-rework/

Station bga solder

 BGA Rework Station

BGA (Ball Grid Array) Rework Station plays a vital role in PCB repair and their modification. This rework station is useful for repairing application, remove defects or replace and reverse components as required.

What is BGA?

It is popularly known as BALL GRID ARRAY and is a form of surface-mount packaging in ICs (Integrated Circuits).

In BGA interconnected pins can be put in the flat or dual in-line package. BGA packages are used to mount Microprocessors permanently.

These rework stations are also known as SMT (Surface Mounted Technology) rework station or SMD (Surface Mounted Device) rework station.

They can also repair ICs with column grid array packaging, chip-scale packages, land grid arrays, quad flat packages and many more.

What are the Benefits of BGA Rework Station?

BGA rework stations have remarkable benefits

  • EFFICIENCY – They comes with specialized tools and ensures technicians to do the job efficiently.
  • VOLUME – A right station help in handling a high volume of rework on different sized PCBs.
  • ACCURACY – It help to achieve the required precision to complete the job safely and accurately without any damage.
  • COST – Spending on the BGA rework station really pays off. It extends the life of PCB.

Uses

It has many different applications in the field of PCB alteration and repair.

  1. Damaged Parts

In a PCB various parts could get damaged due to excess heat or removal of any part. BGA help to rework on those faulty parts.

  1. Upgradation

Technicians need to switch any part or upgrade any part to PCB, so for this BGA rework station is required.

  1. Wrong Assembling

If during the process incorrect orientation of components happens due to thermal profile then PCB needs to rework again to remove the wrong assembly.

Rework Station at Sumitron

If you want to buy a rework station, we sumitron.com is a one-stop destination for all your industrial needs whether it is Mobile- Laptop motherboard repairing, Industrial operations like soldering- desoldering, mixing, etc.

Sours: https://sumitron.com/products/soldering-desoldering-systems/bga-rework-station/
Bga Rework Station - Complete Bga Rework Cycle Incl. Reballing

BGA Rework Stations

What is a BGA Rework Station?

A BGA rework station is a machine that can be used to refinish or repair printed circuit boards (PCBs) with ball grid array (BGA) packaging and surface-mounted devices (SMDs). These rework stations allow the technicians to remove defected parts, reinstall incorrectly placed parts or replace any missing part in the PCBs. Rework stations can also be used to work on PCBs with column grid array packaging, chip scale packages, quad flat packages, land grid arrays or other SMDs. Thus, BGA rework stations are frequently named SMD rework stations or surface-mounted technology (SMT) rework stations.

The features of each BGA rework station dictates the size of the PCBs that can be reworked and the types and volume of jobs that can be performed. For example, BGA rework stations without the split-vision functionality are best for entry-level jobs, while BGA rework stations with it are suitable for more complex jobs. Additionally, some rework stations have automated functions, while other require full manual work.

All machines come fully self contained with their own internal air and vacuum unless otherwise specified.

All of the Shuttle Star Models from the SV530 and up are equipped with industrial PLC control and can be upgraded to come with a cabinet base on wheels.  The cabinet base on wheels is ideal if you need a mobile capability to move the unit for use in different labs or work areas.

Models SV560 and up can be upgraded to come with a side view camera.  This allows you the ability to see the solder reflow on a video screen.

RW-B400C BGA Rework Station

RW-B400C BGA Rework Station

Suitable for entry level jobs that do not require a split vision assist camera;

Fits boards up to 445 mm;

Places components from 4 mm to 55 mm.

SV550 Split Vision BGA Rework Station

SV550 Split Vision BGA Rework Station

High-resolution vision system;

Fits boards up to 635 mm boards;

Places components from 1mm to 120 mm, with available upgrade for 0.22 mm and larger;

Component heater on the top side with 1200W, a component heater on the bottom with 800W and a Six-zone IR underheater with 3600W;

The color optical system is equipped with split vision, zoom, micro-adjust, auto-focus and software operation camera functionalities;

Ready to plug in and use.

SV560 BGA Rework Station

SV560 BGA Rework Station

High resolution HDMI vision System;

Fits up to 915 mm boards;

Able to rework heavy PCBs with many layers;

Places components from 1mm to 120 mm, with available upgrade for 0.22 mm and larger;

Component heater on the top side with 1200W, a component heater on the bottom with 800W and a Six-zone IR underheater with 3600W;

The color optical system is equipped with split vision, zoom, micro-adjust, auto-focus and software operation camera function with a high-definition camera;

High-definition LCD monitor;

Ready to plug in and use.

SV560-A BGA Rework Station

SV560-A BGA Rework Station

Suitable for high-volume work on large boards;

High resolution HDMI vision System;

Fits up to 915 mm boards;

Places components from 1mm and up;

Component heater on the top side with 1200W, a component heater on the bottom with 800W and a Six-zone IR underheater with 3600W;

The color optical system is equipped with split vision, zoom, micro-adjust, auto-focus and software operation camera function with a high-definition camera;

High-definition LCD monitor;

Motorized vision system with auto soldering and mounting functions, motorized X, Y and theta controls, a 15-inch high-definition LCD monitor and five thermal couple inputs;

Ready to plug in and use.

BGA Rework Station E6250U

E6250U – Nitrogen Gas Capable

Ideal for high-yield, lead-free BGA rework of the largest circuit boards;

Fits Boards up to 915 mm;

High Resolution HDMI Vision System;

Uses compressed air or Nitrogen;

Places components from 1mm to 120mm;

Component heater on the top side with 1000W, a component heater on the bottom with 1000W and a six-zone IR underheater with 3600W;

Auto Pick and Place;

Motorized X, Y and Theta controls;

Joy Stick and Touch Screen Control;

Movable Bottom Spot Heater;

High-definition LCD monitor.

The entire head of the machine can move in an X and Y direction with touch sensitive magnetic locks.  The top and bottom component heaters move in conjunction with each other. This allows you the ability to easily rework components at any location including the edge of very large boards.

The color optical system has split vision, zoom and micro-adjust functions.

This model requires and external air source and Nitrogen can be used for the top heater air.

BGA Rework Station E6250U

E6250U – Nitrogen Capable SMD & BGA Rework Station with Cabinet

Same features of the standard E6250U ;

Mounted on a cabinet base with wheels.

Benefits of BGA Rework Stations

BGA rework stations represent a significant investment, but they offer many benefits.

Accuracy: When doing a rework in a PCB the technicians need skill and attention to avoid damage. BGA rework stations provide the necessary tools to achieve the required precision, allowing the job to be completed with accuracy and safety, without damaging the entire device.

Efficiency: BGA rework stations include highly specialized tools, such as nozzles, solder balls and component pickup tubes, that ensure technicians to efficiently tackle the rework job.

Volume: With the right BGA rework station companies can handle a high volume of rework jobs on a variety of different-sized PCBs.

Cost: BGA rework stations are costly but an investment that pays off. Reworking PCBs can significantly extend their lifetime, which reduces costs on reassembling or new purchases.

Application Use for BGA Rework Stations

BGA rework stations have several different applications in the world of PCB repair and alteration.

Upgrades: BGA rework stations are very often used for upgrade works in which technicians need to swap out parts or add upgraded pieces to a PCB.

Faulty parts: Faulty parts frequently can be repaired with BGA rework stations. For example, pads damaged during BGA removal, heat-damage or too much solder joint voiding.

Faulty assembly: Several mistakes can occur during assembly which could be repaired with the help of a BGA rework station. For example, the PCB may have incorrect BGA orientation or a poorly developed BGA rework thermal profile.

Hot Air vs. IR BGA Rework Stations

BGA rework stations can integrate two types of systems to heat up the PCB components: hot air or infrared (IR) radiation.

Hot air BGA rework stations have several nozzles to guide and circulate the hot air, in order to ensure an even heat distribution. The technicians can direct the air by moving the nozzles, allowing a quick, dedicated work on small components. These machines require the use of air pumps, which brings some level of noise to the workspace. This is an older technology, thus many technicians are trained to use hot air BGA rework station as opposed to IR BGA rework stations.

IR BGA rework stations use IR radiation and a fixed ceramic heater to heat the PCB components. These machines are totally silent and involve fewer pieces. Depending on the quality of the BGA rework station, frequent maintenance and additional tools may be required to accomplish the desired jobs. Because this is a new technology, fewer technicians are trained to use these BGA rework stations.

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BGA or Ball Grid Array electronics packages are becoming more and more prevalent as electronics continue their general trend of shrinking smaller and smaller. When something goes wrong with BGA packages, it can be difficult to rework these components. Special rework equipement, typically called a BGA rework station, is needed. Deciding on a BGA rework station can be a daunting task. In this post, we share common facets that should be considered when picking the best BGA rework station for your application.

What to consider when choosing BGA Rework Station

Type or Heat Source

There are two basic types of BGA rework stations, hot air and IR or Infrared. Coincidentally, this also describes the primary heat source for the rework station. As the names imply, hot air rework stations achieve the heat needed to reflow BGA solder by blowing hot air onto the circuit card asseblies. IR BGA rework stations have IR lamps that admit infrared light used to heat BGA components to the point of reflow. There are pros and cons of both types.

Hot Air rework stations have been around the longest, so technicians may be more familiar with this type of system. Hot air systems are also typically more affordable than IR BGA rework stations. That being said, the drawbacks for hot air are difficulty sheilding surrounding components. There is also an issue with noise since the hot air must be pumped through nozzles and directed at the parts being reworked. Finally, high air flow can cause very small components to actually fly off of the circuit cards.

IR rework stations can be very good at locally heating the BGA components if the designed properly. This typically includes a series of lenes and/or shutters used to focus and direct the IR beams specifically on the parts in question. Be careful when searching for "IR BGA rework stations" as many low-end vendors attempt to pass off their units as IR rework stations when they are simply glorified hotplates that use IR as their heat source. IR stations also have the added benefit of being less complex and typically easier to service or maintain.

Most BGA rework stations will have both a top and bottom heating element. The bottom heater is typically a hot plate. The purpose of the bottom heater is to bring the whole CCA or circuit card assembly to an elevated temperature just below melting point. This is needed to help prevent mechanal stress from only locally heating the rework site. The other purpose is to make it easier for the top heater (either an IR lamp or hot air gun) to elevate the rework site to reflow temps.

Temperature Control

Another important consideration when choosing a BGA rework station is method for temperature control. The best rework stations will offer precise, closed-loop, digitally controlled temperature. To put it simply, this means that you can set the temperature digitally, this temperature is measured and fed back into a controller to ensure the proper temperature is achieved and maintained. It is important to note that one should also monitor the temperature of the CCA and as close to the rework site as well.

Work Area Size

The size of the BGA rework station work area is another important consideration to keep in mind. There are really two things to keep in mind. First, the overall area of the work area will determine how big of a circuit card the rework station will be able to effectively handle. The second attribute is the style of the mounting rails. Typically, mounting rails adjust in at least one axis, but the higher end SMT rework stations will have multiple adjustments. This will make it easier to capture and hold complex shaped circuit cards.

Ready to go find the best BGA rework station for your application?

We've done the homework and research for you and have recommended 5 great BGA rework stations.

Sours: http://www.rs-online.com/designspark/considerations-for-picking-bga-rework-station


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